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Partners

Principal investigators from fifteen universities, along with industry and the Defense Advanced Research Projects Agency will collaborate on transformational research to change the future of microelectronics and microsystems. 

University Partners

 

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University of Colorado Boulder

 

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Industry and Governmental Partners

 

 

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 IBM logo

 

Micron Technology

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EMD Electronics

 

 

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 HRL Laboratories

 

 

 DARPA

 

 

 


Raytheon Technologies

 

 

 TSMC

 

 

 QORVO

 

 

Global Foundries

 

 

 

Samsung 

 

 


Mediatek
 
 

About

The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogenous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. 

Center for Heterogeneous Integration of Micro Electronic Systems

The Pennsylvania State University

University Park, PA 16802