Seminars

Distinguished Lectures

2023

April 21

Hong Tang
Llewellyn West Jones Jr. Professor of Electrical Engineering, Physics, and Applied Physics, Yale University
View recording »


March 17

Ravi Mahajan
Intel Fellow, Member of the National Academy of Engineers
View recording »
 


Research Seminars

The Future of Heterogeneous Integration for mmWave Systems - Challenges and Opportunities

Madhavan Swaminathan
Department Head of Electrical Engineering, William E. Leonhard Endowed Chair, and Director of CHIMES
View recording »

Bayseian Learning for Unvertainty Quantification, Optimization, and Inverse Design

Madhavan Swaminathan
Department Head of Electrical Engineering, William E. Leonhard Endowed Chair, and Director of CHIMES
View recording »

Glass Core Substrates, Opportunities for CHIPS and MMI—from Research to Manufacturing

Madhavan Swaminathan
View recording »

Advanced Packaging for Advanced Communications from Research to Manufacturing Opportunities for CHIPS & MMI (MASH workshop, May 2023)

Madhavan Swaminathan
View recording »

 

 
 

About

The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogenous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. 

Center for Heterogeneous Integration of Micro Electronic Systems

The Pennsylvania State University

University Park, PA 16802